Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

SKU

HTK-002-U1-GP

Skip to the end of the images gallery

Skip to the beginning of the images gallery

In stock

0.8 °C/W, 550 volts/mil, 21.7 kV/mm

Suitable for CPU, chipsets on Mainboard, VGA card, etc
Easy to use
Zif Socket Templates ensure correct applying area with various CPU socket types
Produces an even layer when using applicator
Dielectric
Wide range of application temperature

Category: Heat Sink Compounds

More Information

More Information
Type	Thermal paste
SKU	HTK-002-U1-GP
EAN	4719512002940
Manufacturer	Cooler Master
Availability	Y

Description

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Specifications

Features
Type	Thermal paste
Thermal resistance	0.8 °C/W
Thermal conductivity	4.5 W/m·K
Product colour	White
Specific gravity	2.37 g/cm³
Packaging data
Package width	102 mm
Package depth	171 mm
Package height	40 mm
Quantity per pack	1 pc(s)
Technical details
Thermal resistance	0.8 °C/W
Thermal conductivity	4.5 W/m·K

Weight & dimensions
Package width	102 mm
Package depth	171 mm
Package height	40 mm
Colour
Product colour	White
Logistics data
Quantity per pack	1 pc(s)

You may also be interested in

Compare Products
Product	Cooler Master HTK-002 heat sink compou... Login for pricing	ARCTIC MX-4 (20 g) Edition 2019 – High... Login for pricing	be quiet! DC2 PRO heat sink compound T... Login for pricing
SKU	HTK-002-U1-GP	ACTCP00001B	BZ005
Manufacturer	Cooler Master	ARCTIC	be quiet!
Type	Thermal paste	Thermal paste	N/A